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Chip Design Engineer

Quorum：

2

Time：

2024-05-21

Salary Interview

Job responsibilities:

1.Responsible for the design of high power semiconductor laser chips, establish the simulation capability of epitaxial structure, device structure, heat and stress;
2.In response to the needs put forward by the project, complete the design scheme development, and communicate with the project technical leader to determine, to achieve the goal of meeting the target requirements put forward by each project;
3.Analyse and optimise the performance and reliability of semiconductor laser chips, form a database and iterate continuously to ensure the smooth progress of R&D projects from the design perspective;
4.Participate in the analysis and discussion of key issues in the R&D project, assist in analysing the reasons and propose solutions from the chip design perspective; 5.Responsible for or involved in product development project declaration and project implementation.

Qualifications:
1.Doctoral degree, microelectronics, semiconductor materials, physics and other related professional, solid theoretical knowledge;
2.5 years of experience in semiconductor laser chip epitaxial structure, device structure simulation, with strong optical, electrical and thermal simulation capabilities, proficient in the use of commercial simulation software, such as PICS3D, LaserMod, Comsol and so on;
3.Familiar with the principle of semiconductor lasers, understand all aspects of GaAs semiconductor laser development;
4. Experience in semiconductor laser chip project development is preferred;
5.Ability to quickly read English literature and analyse and summarize;
6. Positive, enterprising, strong sense of responsibility, strong self-discipline, high work ethic, ability to work independently and withstand pressure;
7. good logical thinking, communication and collaboration skills, and good teamwork spirit;
8. good written writing skills, thoroughness, project reporting experience is preferred.

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Research and Development Engineer

Quorum：

2

Time：

2024-05-21

Salary Interview

Job responsibilities:

1. As the main member of the R&D team, participate in product development work and assist the person in charge to complete new product development;
2.Confirmation of process parameters in product development, communication of requirements and completion of orders;
3.Leading or assisting in analysing and solving technical and technological problems in R&D;
4.Test demand confirmation and test communication, test data analysis and report collation;
5.To carry out key information filing and assist in data collation and filing.

Qualifications:
1. Master's degree or Bachelor's degree or above with more than 5 years of experience, majoring in microelectronics, semiconductor materials, physics, optics and other related disciplines, with solid foundation in optoelectronic physics;
2.Ability to independently solve problems encountered in project development;
3. Be conscientious and responsible, with strong learning ability and execution ability;
4. Good communication skills and strong sense of responsibility;
5. Ability to read English literature;
6. High-power semiconductor laser chip R & D project experience is preferred;
7. Mastery of one or several key technologies such as laser chip epitaxy, lithography, coating and packaging is preferred.

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Process Manager

Quorum：

2

Time：

2024-05-21

Salary Interview

Job responsibilities:

1.Bachelor degree or above, majoring in optics, microelectronics, semiconductor, physics, electronic engineering and other related fields.
2. More than five years of work experience, a comprehensive and deep understanding of optical and packaging development business processes, proficiency in packaging coupling key processes, the most profound understanding of hermetic packaging and non-hermetic packaging.
3. Semiconductor optical device characteristics, design process and reliability.
4,.Strong PPT writing and oral communication skills, with the initiative to work with others in the team.

Qualifications:
1. Guide and responsible for optical and packaging technology platform planning and construction, and key packaging equipment vendors to coordinate and communicate with the development of new products suitable for the packaging process platform.
2. Guide and be responsible for the development and improvement of packaging process (wire bonding, mounting, optical coupling, etc.).
3. Responsible for assessing the risk of each part of the product packaging, the implementation of simulation or experiment to verify the key elements, so that the risk becomes controllable.
4. Monitoring and responsible for sample production and small batch trial production, and optimise and improve the design and process flow, with product engineers to complete the NPI work.
5. Monitor all project progress of the whole process development department.
6. Responsible for the generation and management of technical documents required for research and development, responsible for regular or at any time to the leadership report.
7. Strong sense of responsibility, good communication, logical thinking in process design.

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