+

Silicon Carbide (SiC) Submount

◆ Monocrystalline Silicon Carbide (SiC) substrate ◆ High thermal conductivity ≥370W/m*K ◆ Prefabricated gold tin solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >500V
◆ Monocrystalline Silicon Carbide (SiC) substrate ◆ High thermal conductivity ≥370W/m*K ◆ Prefabricated gold tin solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >500V
  • Product Description
  • Features

    Prefabricated gold-tin solder

    High thermal conductivity ≥370W/m*K

    CTE matched for chip bonding

    High insulation quality >500V

    Applications

    • Coupling Module

    • Medical Cosmetology

    • Scientific Research

     

Inquire Now

▪ The above information is only used for the purpose of demand collection and matching, Dogain promises to keep the information confidential and never use it in other commercial ways.

Submit

DOGAIN