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Aluminum Nitride (AlN) Submount

◆ Thick-film process ◆ Prefabricated Au-Sn solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >1000V

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Silicon Carbide (SiC) Submount

◆ Monocrystalline Silicon Carbide (SiC) substrate ◆ High thermal conductivity ≥370W/m*K ◆ Prefabricated gold tin solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >500V

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TO Submount

◆Thin film process ◆Prefabricated gold-tin solder on double-sided ◆Thermal conductivity of the substrate ≥ 200W/m*K ◆Low to medium power package applications ◆Customized solution available

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DPC Thick Film Ceramic Substrate

◆ Copper thickness Customizable 30~100um , TTV ≤10μm ◆ Roughness of the copper surface Ra≤0.1μm ◆ A/B face misalignment ≤20μm ◆ Electroplating gold optional ◆ Support round and square substrate customization

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830nm Cooled Pump Laser Module DG-HS01 Series

HS01 series 808nm single-mode pump laser adopts self-developed chips, which have undergone strict performance and reliability screening to ensure the excellent performance and reliability level of pump lasers. ● 14-pin low-stress, high-airtight butterfly package to ensure stable output power of 330mW. ● The HS series consists of a thermoelectric cooler (TEC), a precision NTC thermistor, and a backside monitoring photodiode. ● Reliability and hermeticity are fully compliant with Telcordia GR-468-CORE communication standards

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1064nm Cooled DFB Seeds Laser Module DG-HS05-NBF Series

The HS05 series 1064nm single-mode laser seeding module adopts self-developed DFB chip, which has undergone strict performance and reliability screening to ensure the excellent performance and reliability level of the laser seeding module. ● The 14-pin low-stress, high-airtight butterfly package ensures that the stable output power of the fiber > 200mW ● The HS05 series consists of a thermoelectric cooler (TEC), a precision NTC thermistor, and a backside monitoring photodiode. ● Reliability and hermeticity are fully compliant with Telcordia GR-468-CORE communication standards.

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1064nm Uncooled Seeds Laser Module DG-HDG3-WBW Series

HD series 1064nm single-mode pump lasers use self-developed chips, which have undergone strict performance and reliability screening to ensure the excellent performance and reliability level of pump lasers. ● The 3-pin low-stress, high-airtight butterfly package ensures a stable output power of >300mW for the fiber ● Reliability and hermeticity are fully compliant with Telcordia GR-468-CORE communication standards.

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1064nm Cooled Seeds Laser Module DG-HS02-NBF Series

The HS02 series 1064nm single-mode pump laser adopts self-developed chips, which have undergone strict performance and reliability screening to ensure the excellent performance and reliability level of the laser seed source module. ● 14-pin low-stress, high-gas-tight butterfly package to ensure stable output power of > 1000mW. ● The HS series consists of a thermoelectric cooler (TEC), a precision NTC thermistor, and a backside monitoring photodiode. ● Reliability and hermeticity are fully compliant with Telcordia GR-468-CORE communication standards.

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1064nm Cooled Seeds Laser Module DG-HS03-WBW Series

HS-WBW series 1064nm single-mode seed-source lasers use self-developed chips, which have undergone strict performance and reliability screening to ensure the excellent performance and reliability level of the lasers. ● 14-pin low-stress, high-gas-tight butterfly package to ensure a stable output power of >500mW of optical fiber· The HS-WBW series consists of a thermoelectric cooler (TEC), a precision NTC thermistor, and a backside monitoring photodiode. ● Reliability and hermeticity are fully compliant with Telcordia GR-468-CORE communication standards.

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