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Aluminum Nitride (AlN) Submount

◆ Thick-film process ◆ Prefabricated Au-Sn solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >1000V

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Silicon Carbide (SiC) Submount

◆ Monocrystalline Silicon Carbide (SiC) substrate ◆ High thermal conductivity ≥370W/m*K ◆ Prefabricated gold tin solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >500V

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TO Submount

◆Thin film process ◆Prefabricated gold-tin solder on double-sided ◆Thermal conductivity of the substrate ≥ 200W/m*K ◆Low to medium power package applications ◆Customized solution available

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DPC Thick Film Ceramic Substrate

◆ Copper thickness Customizable 30~100um , TTV ≤10μm ◆ Roughness of the copper surface Ra≤0.1μm ◆ A/B face misalignment ≤20μm ◆ Electroplating gold optional ◆ Support round and square substrate customization

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