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TO Submount

◆Thin film process ◆Prefabricated gold-tin solder on double-sided ◆Thermal conductivity of the substrate ≥ 200W/m*K ◆Low to medium power package applications ◆Customized solution available
◆Thin film process ◆Prefabricated gold-tin solder on double-sided ◆Thermal conductivity of the substrate ≥ 200W/m*K ◆Low to medium power package applications ◆Customized solution available
  • Product Description

  • Features

    Thin film process

    Thermal conductivity of the substrate ≥ 200W/m*K

    Low to medium power package applications

    Prefabricated gold-tin solder on double-sided

    Applications

    • TO Package

    • Lidar

    • Photoelectric detection

     

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