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DPC Thick Film Ceramic Substrate

◆ Copper thickness Customizable 30~100um , TTV ≤10μm ◆ Roughness of the copper surface Ra≤0.1μm ◆ A/B face misalignment ≤20μm ◆ Electroplating gold optional ◆ Support round and square substrate customization
◆ Copper thickness Customizable 30~100um , TTV ≤10μm ◆ Roughness of the copper surface Ra≤0.1μm ◆ A/B face misalignment ≤20μm ◆ Electroplating gold optional ◆ Support round and square substrate customization
  • Product Description

  • Features

    Copper thickness Customizable 30~100um ,  TTV ≤10μm

    High thermal conductivity ≥200W/m*K

    Roughness of the copper surface Ra≤0.1μm

    A/B face misalignment ≤20μm

    Applications

    • Laser Diode (LD) Heat Sink

    • Miniature Thermoelectric Cooler (TEC)

    • Power electronics

     

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