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Aluminum Nitride (AlN) Submount

◆ Thick-film process ◆ Prefabricated Au-Sn solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >1000V
◆ Thick-film process ◆ Prefabricated Au-Sn solder ◆ CTE (coefficient of thermal expansion) matching with laser diode ◆ High insulation quality >1000V
  • Product Description

  • Features

    Prefabricated gold-tin solder

    High thermal conductivity ≥200W/m*K

    CTE matched for chip bonding

    High insulation quality >1000V

    Applications

    • Coupling Module

    • Medical Cosmetology

    • Scientific Research

      

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