2025-08-04
The single light output power of high-power semiconductor laser chips continues to increase, and the current mainstream application has risen to 45W, but when moving towards higher power 50W, 60W or even higher power, the thermal conductivity of ceramic heat sink, which is the "heat dissipation backing" of the chip, has become a constraint, although the thermal conductivity of AlN ceramics has increased from the previous 170W/m·K to the current 230W/m·K, which has still become a "stumbling block" restricting the breakthrough of chip light output. The monocrystalline SiC thermal sink independently developed and produced by Dugen Core in the whole process has brought disruptive heat dissipation solutions to the industry.
Dogain Optoelectronic
Add:Unit 203, 2nd Floor, Bld. 2E, Phase One, Hong Kong Science Park, Pak Shek Kok, Hong Kong, China
Sales Email:Sales@dogain.com
Fax:+86 512-62385166
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